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Soldering bonds the semiconductor chip to the substrate by means of metal alloys, typically Sn-based. Proven, simple and cost-effective, this die-attach method is widely used in power module manufacturing.
Advanced die-attach technology
The thermal and mechanical link between the chip and substrate matters. The choice of die-attach method has a great impact on a module’s ability to dissipate heat and perform reliably over its lifetime.
Balancing thermal management, mechanical stability and reliability
Modern-day use cases demand much from power semiconductors. They have to operate at even higher currents and temperatures. The die-attach layer must dissipate heat efficiently and keep the module operating reliably.
Each of the two predominant die-attach methods – soldering and silver sintering – has different strengths and constraints. The right choice hinges upon the thermal load, mechanical stress, and lifetime expectations for the use case. With a clear understanding of these differences, engineers are able to strike the best balance between thermal management, mechanical stability and reliability.
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