TIM pattern
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Applying thermal interface material is unavoidable to guarantee a good thermal coupling between the power module and the heatsink. The material provides an extremely long stability, which is the most important characteristic. Especially modules with convex pre-bent lower-surfaces support this requirement.
Pattern for Vincotech modules
Download the thermal interface material pattern from this page. All patterns and thickness options are used for phase‑change materials as well as thermal greases. The patterns are also available on the product detail pages, making it easy to find the correct layout.
flow modules
Module | Minimum / µm | Typical / µm | Maximum / µm | Downloads |
|---|---|---|---|---|
flow S3 | 50 | 65 | 80 | |
flow 0B | 40 | 55 | 70 | |
flow 0 | 30 | 55 | 80 | |
flow 1B | 70 | 90 | 110 | |
flow 1C | 70 | 90 | 110 | |
flow 1 Al2O3 | 30 | 50 | 80 | |
flow 1 AlN | 30 | 50 | 60 | |
flow 2 | 80 | 110 | 140 | |
flow90 0 | 35 | 60 | 85 | |
flow90 1 | 45 | 70 | 95 | |
flow E1 | 45 | 60 | 75 | |
flow E2 | 45 | 60 | 75 | |
flow E3 | 50 | 65 | 80 | |
flow E3BP | 70 | 90 | 110 |
VINco modules
Module | Minimum / µm | Typical / µm | Maximum / µm | Downloads |
|---|---|---|---|---|
VINco X | 115 | 140 | 160 | |
VINco E3 | 100 | 120 | 140 |
MiniSKiiP®
Module | Minimum / µm | Typical / µm | Maximum / µm | Downloads |
|---|---|---|---|---|
MiniSKiiP® 0 | 40 | 55 | 70 | |
MiniSKiiP® 1 | 50 | 70 | 90 | |
MiniSKiiP® 2 | 60 | 75 | 90 | |
MiniSKiiP® 3 | 50 | 65 | 80 |