Press-fit technology
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Vincotech’s Press-fit technology streamlines power module assembly. Easy solderless mounting on top or bottom of the PCB improves reliability, increases design flexibility and drives down manufacturing costs.
Fast-tracking assembly with solder-less technology
No soldering for faster, flexible top- or bottom-side mounting: Press-fit is the way to go to cut production time and costs while boosting output and enabling greater flexibility in design. 3D data for housing-specific press-in tools are available on each product page.
Reliable cold-welded connections and push and pull force relief minimize thermo-mechanical stress and PCB damage for greater robustness.
Building on a gas-tight, cold-welded bond
Made of a copper alloy with nickel plating and a tin finish, every Y- or T-type pin comes with an s-bend at the bottom to provide stress relief. Pushed or pulled as needed for a pre-bent DCB or baseplate, this stress-relief also offsets heat- and cold-induced expansion and contraction.
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Going solder-less for greater reliability
Recommended for PCBs with I‑Sn, HA(S)L, or NiAg surface finishes, these pins support up to 30 A at 25 °C, depending on PCB copper thickness and layout.
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