fastPACK E1 SiC

Basic information

• Product line: fastPACK E1 SiC
• Product status: Series
• Standard packaging quantity (pieces): 100

Electrical characteristics

• Voltage: 1200 V
• Current: 50 A
• R(DS)on: 18 mOhm

H-Bridge

• Kelvin Emitter for improved switching performance
• Temperature sensor

Chip & isolation characteristics

SiC MOSFET

• Easy paralleling
• Low on-resistance
• Fast switching speed
• Fast recovery body diode

Isolation

• Base isolation: Al₂O₃

Mechanical & housing characteristics

flow E1

• Mechanical connection to PCB: 4 towers
• Footprint: 62.8 mm x 34.8 mm
• Height: 12 mm
• Pin type: Press-fit pin