fastPACK E2 SiC
10-EY124PA016ME01-LP49F16T
Topology Housing Voltage R(DS)on Main chip technology Product status
Product description
Basic information
- Product line: fastPACK E2 SiC
- Product status: Engineering Sample
- Standard packaging quantity (pieces): 100
Electrical characteristics
- Voltage: 1200 V
- Current: 80 A
- R(DS)on: 16 mOhm
- Kelvin Emitter for improved switching performance
- Open Emitter configuration
- Temperature sensor
H-Bridge
Chip & isolation characteristics
- High Blocking Voltage with low drain source on state resistance
- High speed SiC-MOSFET technology
- Resistant to Latch-up
SiC MOSFET
- Base isolation: AlN
Isolation
Mechanical & housing characteristics
- Mechanical connection to PCB: 4 towers
- Footprint: 62.8 mm x 57.7 mm
- Height: 12 mm
- Pin type: Press-fit pin
flow E2