Wide badgap technologies such as SiC and GaN push efficiency, thermal performance, and power density beyond conventional silicon.
Power modules
Every application has unique power challenges. Vincotech power modules are built to solve them. Each module is engineered for high efficiency, long-term reliability, and seamless integration to accelerate development and reduce system complexity.
Incorporating IGBT, MOSFET, and hybrid technologies, the portfolio supports motion control, renewable energy, and power supply applications.
Explore Vincotech's power modules
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Showcasing the latest power modules for next-gen systems
The next level of performance
flow E3BP+ boosts power density for PV and PCS: built on the proven flow 2 and flow E3BP platforms, Vincotech's new flow E3BP+ baseplate module introduces major system-level gains through module-level innovation.
Optional Si3N4 substrate
Operates at high junction temperatures up to 175 °C
Capable for transient overloads
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Smarter cooling with SiC power
This highly integrated, full-SiC power module combines three-phase active neutral-point power factor correction (AN-PFC) with an inverter in a single housing to enable efficient power conversion for next-generation HVAC systems.
High efficiency
Compact integration
Superior thermal management
Quiet operation with high-frequency switching
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Maximizing efficiency, minimizing losses
The flowNPFC 1 and flowMNPC E2 SiC power modules support three-level PFC topologies with output power levels of up to 60 kW. It enables high power density and scalable charger systems of 400 kW and higher.
Latest 650V and 1200V SiC MOSFET technology
Optimized pinout with very symmetrical internal chip layout
Improved power cycling capability
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Pairing efficiency with reliability
The 200 A flowMNPC E2 SiC module balances efficiency, power quality and reliability for UPS input stages. It reduces switching losses, boosts performance, supports higher power density and improves thermal behavior and reliability.
SiC MOSFETs
Lower switching losses
Convex substrate for superior thermal performance
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The next level of performance
flow E3BP+ boosts power density for PV and PCS: built on the proven flow 2 and flow E3BP platforms, Vincotech's new flow E3BP+ baseplate module introduces major system-level gains through module-level innovation.
Optional Si3N4 substrate
Operates at high junction temperatures up to 175 °C
Capable for transient overloads
)
)
Smarter cooling with SiC power
This highly integrated, full-SiC power module combines three-phase active neutral-point power factor correction (AN-PFC) with an inverter in a single housing to enable efficient power conversion for next-generation HVAC systems.
High efficiency
Compact integration
Superior thermal management
Quiet operation with high-frequency switching
)
)
Maximizing efficiency, minimizing losses
The flowNPFC 1 and flowMNPC E2 SiC power modules support three-level PFC topologies with output power levels of up to 60 kW. It enables high power density and scalable charger systems of 400 kW and higher.
Latest 650V and 1200V SiC MOSFET technology
Optimized pinout with very symmetrical internal chip layout
Improved power cycling capability
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)
Pairing efficiency with reliability
The 200 A flowMNPC E2 SiC module balances efficiency, power quality and reliability for UPS input stages. It reduces switching losses, boosts performance, supports higher power density and improves thermal behavior and reliability.
SiC MOSFETs
Lower switching losses
Convex substrate for superior thermal performance
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